Abstract: With the purposes of building the electronic packaging discipline and cultivating interdisciplinary talents, the exploration and research of electronic packaging in electronic technology practice are carried out through the combination of theoretical explanation, the flipped classroom and practical operation. This only consummates the packaging system of electronic technology practice, allowing students to learn the interdisciplinary knowledge of material science, electronic technology and computer system involved in the electronic packaging discipline, but also let them experience microelectronics manufacturing technology and improves their analysis ability, design ability and the practical abilities for high-precision manufacturing equipment and test equipment, stimulates students’ interests in electronic packaging and related fields, and lays a solid foundation for further training talents of the industry.